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SPECIFICATIONS
· CL(IDD) - 22 cycles
· Row Cycle Time (tRCmin) - 45.75ns(min.)
· Refresh to Active/Refresh, Command Time (tRFCmin) - 350ns(min.)
· Row Active Time (tRASmin) - 32ns(min.)
· UL Rating- 94 V-0
· Operating Temperature - 0° C to +85° C
· Storage Temperature -55° C to +100° C
FEATURES
· Power Supply: VDD = 1.2V Typical
· VDDO 1.2V Typical
· VPP2.5V Typical
· VDDSPD 2.2V to 3.6V
· Nominal and dynamic on-die termination (ODT) for data, strobe, and mask signals
· Low-power auto self-refresh (LPASR)
· Data bus inversion (DB) for data bus
· On-die VREFDQ generation and calibration
· Single-rank
· On-board 12 serial presence-detect (SPD) EEPROM
· B internal banks: 2 groups of 4 banks each
· Fixed burst chop (BC) of 4 and burst length (BL) of 8 via the made register set (MRS)
· Selectable BC4 or BLB on-the-fly (OTF)
· Fly-by topology
· Terminated control command and address but
· PCB Height 1.18° (30.00mm)
· RoHS Compliant and Halogen-Free
